Invention Grant
- Patent Title: Scrap removal device for a laser processing device
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Application No.: US14973963Application Date: 2015-12-18
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Publication No.: US10213873B2Publication Date: 2019-02-26
- Inventor: Chun-Ming Chen , Chun-Jen Gu , Chun-Ping Jen
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Priority: TW104136200A 20151103
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/16 ; B23K26/388 ; B23K26/142 ; B23K103/00

Abstract:
A scrap removal device for a laser processing device includes a gas deflector having an optical channel; a looped gas channel; and a looped gas outlet. The looped gas outlet is connected to the looped gas channel, the optical channel is configured for a laser beam to transmit through, the looped gas channel surrounds the optical channel, and a section of the looped gas channel close to the looped gas outlet is inclined. The scrap removal device further includes a gas source furnished on the gas deflector and in communication with the looped gas channel for providing a gas flow to flow into the looped gas channel. The gas flow is joined with the laser beam transmitting along a looped processing path when flowing out of the gas deflector through the looped gas channel and the looped gas outlet.
Public/Granted literature
- US20170120382A1 LASER PROCESSING DEVICE AND SCRAP REMOVAL DEVICE USING THE SAME Public/Granted day:2017-05-04
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