Invention Grant
- Patent Title: Electronic device module and manufacturing method thereof
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Application No.: US14676745Application Date: 2015-04-01
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Publication No.: US10219380B2Publication Date: 2019-02-26
- Inventor: Do Jae Yoo , Jae Hyun Lim , Kyu Hwan Oh , Jong In Ryu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0041668 20140408
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/40 ; H05K1/11 ; H05K3/28 ; H05K3/34
Abstract:
An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.
Public/Granted literature
- US20150289392A1 ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-10-08
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