公开(公告)号：US10163746B2

公开(公告)日：2018-12-25

申请号：US15003473

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In Ryu ,  Ki Joo Sim ,  Do Jae Yoo ,  Ki Ju Lee ,  Jin Su Kim

IPC: H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/768 ,  H01L23/538 ,  H01L21/268 ,  H01L23/16 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

公开(公告)号：US09585260B2

公开(公告)日：2017-02-28

申请号：US14260007

申请日：2014-04-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun Lim ,  Jong In Ryu ,  Sun Ho Kim ,  Eun Jung Jo ,  Kyu Hwan Oh ,  Do Jae Yoo

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/28 ,  H05K3/40 ,  H01L23/00 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/3478 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10787 ,  H05K2203/0228 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract translation: 提供一种能够通过将电子部件安装在基板的两个表面上而提高集成度的电子部件模块及其制造方法。 根据本公开的示例性实施例的电子部件模块包括：基板; 安装在所述基板的两个表面上的多个电子部件; 连接导体各自具有使用导电粘合剂结合到基板的一个表面的一端; 以及模制部分，其具有嵌入其中并且形成在基板的一个表面上的连接导体，其中连接导体可以具有防止导电粘合剂扩散的至少一个阻挡构件。

公开(公告)号：US09496219B2

公开(公告)日：2016-11-15

申请号：US13935148

申请日：2013-07-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Jung Ho Yoon ,  Chul Gyun Park ,  Myeong Woo Han ,  Jung Aun Lee

IPC: H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L23/40 ,  H01L23/522 ,  H01L23/498 ,  H01L21/56 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01L21/00 ,  H05K1/18 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/185 ,  H05K2203/061 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.

Abstract translation: 一种半导体封装，包括与其一体形成的天线。 半导体封装包括：半导体芯片; 密封半导体芯片的密封部分; 形成在所述密封部的至少一个表面上的基板部; 以及形成在所述密封部上并与半导体芯片电连接的天线部。

公开(公告)号：US09202798B2

公开(公告)日：2015-12-01

申请号：US13846626

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Sun Woo Yun ,  Joon Seok Chae ,  Kwang Soo Kim

IPC: H01L23/00 ,  H05K1/18 ,  H05K3/40 ,  H01L25/07 ,  H01L23/373 ,  H01L23/42 ,  H01L23/498 ,  H01L23/24

CPC classification number: H01L24/80 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10962 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/14 ,  H01L2924/0665

Abstract: Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.

Abstract translation: 这里公开了一种功率模块封装，其包括外部连接端子; 将允许外部连接端子的一端插入其中的紧固单元埋设在厚度方向上的预定深度的基板; 以及安装在所述基板的一个表面上的半导体芯片。

公开(公告)号：US09105601B2

公开(公告)日：2015-08-11

申请号：US14106107

申请日：2013-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Do Jae Yoo ,  Bum Seok Suh

IPC: H01L23/40 ,  H01L23/492 ,  H01L23/64 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H01L23/498 ,  H01L23/053 ,  H01L23/31

CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein is a power module package including: a substrate including a metal layer, a first insulation layer formed on the metal layer, a first circuit pattern formed on the first insulation layer and including a first pad and a second pad spaced apart from the first pad, a second insulation layer formed on the first insulation layer to cover the first circuit pattern, and a second circuit pattern formed on the second insulation layer and including a third pad formed on a location corresponding to the first pad and a fourth pad spaced apart from the third pad; a semiconductor chip mounted on the second circuit pattern; one end being electrically connected to the semiconductor chip, and another end protruding from the outside, wherein the first pad and the third pad, and the second pad and the fourth pad have different polarities.

Abstract translation: 本文公开了一种功率模块封装，包括：基板，包括金属层，形成在金属层上的第一绝缘层，形成在第一绝缘层上的第一电路图案，并且包括第一焊盘和与第一绝缘层间隔开的第二焊盘 衬垫，形成在第一绝缘层上以覆盖第一电路图案的第二绝缘层和形成在第二绝缘层上的第二电路图案，并且包括形成在与第一焊盘相对应的位置上的第三焊盘和间隔开的第四焊盘 从第三垫; 安装在第二电路图案上的半导体芯片; 一端电连接到半导体芯片，另一端从外部突出，其中第一焊盘和第三焊盘以及第二焊盘和第四焊盘具有不同的极性。

公开(公告)号：USD708578S1

公开(公告)日：2014-07-08

申请号：US29456642

申请日：2013-05-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Designer： Do Jae Yoo ,  Sun Ho Kim ,  Kwang Soo Kim ,  Bum Seok Suh

公开(公告)号：US20240032201A1

公开(公告)日：2024-01-25

申请号：US18102285

申请日：2023-01-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Yong Gil Namgung ,  Jong Hoon Shin ,  Won Ju Jang ,  Yun Hwan Kim

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/05 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/185 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/0296 ,  H05K3/10 ,  H05K2203/013 ,  H05K2201/0206

Abstract: A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

公开(公告)号：US11387270B2

公开(公告)日：2022-07-12

申请号：US16535123

申请日：2019-08-08

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Do Jae Yoo ,  Byoung Heon Kim ,  Yong Gil Namgung ,  Jong Cheol Hong ,  Si Joong Yang

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor package includes a substrate, an image sensor mounted on the substrate, a bonding wire connecting the image sensor to the substrate, a reflector disposed on the image sensor, a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member including a hole exposing an effective imaging plane of the image sensor, and a filter attached to the sealing member.

公开(公告)号：US09343391B2

公开(公告)日：2016-05-17

申请号：US14296061

申请日：2014-06-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyu Hwan Oh ,  Do Jae Yoo

IPC: H01L31/062 ,  H01L23/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31

CPC classification number: H01L23/481 ,  H01L21/565 ,  H01L21/76816 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/19 ,  H01L25/03 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate including a mounting electrode formed on both sides and a wiring; a plurality of first electronic devices mounted on the substrate; a second electronic devices mounted on the substrate; and a via through which the wiring of the substrate and the second electronic devices are connected.

Abstract translation: 这里公开了一种半导体封装及其制造方法。 半导体封装包括：包括形成在两侧的安装电极和布线的基板; 安装在所述基板上的多个第一电子装置; 安装在基板上的第二电子装置; 以及基板和第二电子设备的布线连接的通孔。

公开(公告)号：US09076660B2

公开(公告)日：2015-07-07

申请号：US14103574

申请日：2013-12-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Kwang Soo Kim ,  Sun Woo Yun ,  Young Ki Lee ,  Do Jae Yoo

IPC: H01L23/12 ,  H01L23/34 ,  H01L23/053 ,  H01L23/373

CPC classification number: H01L23/053 ,  H01L23/3735 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.

Abstract translation: 本文公开了一种功率模块封装，包括：第一模块，其由具有一个表面和另一个表面的第一衬底构成，安装在第一衬底的一个表面上的第一半导体芯片和形成为覆盖第一半导体芯片的第一密封构件 在第一基板的厚度方向上从两侧安装在第一基板的一个表面上，并露出第一基板的另一个表面; 以及包围第一模块的壳体。