Invention Grant
- Patent Title: High speed, efficient SiC power module
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Application No.: US15295599Application Date: 2016-10-17
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Publication No.: US10224810B2Publication Date: 2019-03-05
- Inventor: Adam Barkley , Marcelo Schupbach
- Applicant: Cree, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agent Anthony J. Josephson
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H02M3/155 ; H02M1/08 ; H02M7/00 ; H05K5/02 ; H01L29/78 ; H01L29/872 ; H01L25/18 ; H01L23/00 ; H01L23/373 ; H01L25/07 ; H02M1/44 ; C04B37/02 ; H02M1/00 ; H02M1/34

Abstract:
A power converter module includes a baseplate, a substrate on the baseplate, one or more silicon carbide switching components on the substrate, and a housing over the baseplate, the substrate, and the one or more silicon carbide switching components. The housing has a footprint less than 25 cm2. Including a baseplate in a power converter module with a footprint less than 25 cm2 runs counter to accepted design principles for silicon and silicon carbide-based power converter modules, but may improve performance of the power converter module and/or decrease the cost of the power converter module.
Public/Granted literature
- US20170040890A1 HIGH SPEED, EFFICIENT SIC POWER MODULE Public/Granted day:2017-02-09
Information query
IPC分类: