Invention Grant
- Patent Title: Composite electronic component and board having the same
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Application No.: US14869935Application Date: 2015-09-29
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Publication No.: US10229790B2Publication Date: 2019-03-12
- Inventor: Sang Soo Park , Kyoung Jin Jun , Young Ghyu Ahn , Heung Kil Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2014-0155179 20141110
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/228 ; H01G4/40 ; H05K3/30 ; H05K3/34 ; H01G4/12 ; H05K3/32

Abstract:
A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.
Public/Granted literature
- US20160133386A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2016-05-12
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