公开(公告)号：US09520233B2

公开(公告)日：2016-12-13

申请号：US15003614

申请日：2016-01-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyoung Jin Jun ,  Su Jung Kim ,  Young Ghyu Ahn ,  Sang Soo Park ,  Heung Kil Park ,  Soon Ju Lee

IPC: H01G4/228 ,  H01G4/30

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/30

Abstract: An electronic component and a board having the same are provided. The electronic component according to an exemplary embodiment in the present disclosure may include a body having upper and lower surfaces, first and second side surfaces, and third and fourth side surfaces; external electrodes disposed on at least one of the upper and lower surfaces and the third and fourth side surfaces of the body; and connection terminals disposed on the external electrodes, wherein the connection terminals are disposed inwardly to be spaced apart from an edge of a surface of the body on which the connection terminals are disposed.

Abstract translation: 提供电子部件和具有该电子部件的电路板。 根据本公开的示例性实施例的电子部件可以包括具有上表面和下表面的主体，第一和第二侧表面以及第三和第四侧表面; 设置在所述主体的上表面和下表面以及所述第三和第四侧表面中的至少一个上的外部电极; 以及设置在外部电极上的连接端子，其中连接端子向内设置成与设置有连接端子的主体的表面的边缘间隔开。

公开(公告)号：US09775244B2

公开(公告)日：2017-09-26

申请号：US14940946

申请日：2015-11-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Young Ghyu Ahn ,  Sang Soo Park ,  Soon Ju Lee ,  Kyoung Jin Jun ,  So Yeon Song

IPC: H05K1/16 ,  H05K1/11 ,  H01G2/06 ,  H01G4/228

CPC classification number: H05K1/111 ,  H01G2/06 ,  H01G4/228

Abstract: A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes having respective dielectric layers interposed therebetween, and first and second external electrodes respectively including first and second connection portions, and first and second band portions extended from the first and second connection portions, and first and second metal frames respectively including first and second upper horizontal portions, first and second lower horizontal portions, and first and second inclined support portions diagonally connecting the first and second upper horizontal portions and the first and second lower horizontal portions, respectively.

公开(公告)号：US10229790B2

公开(公告)日：2019-03-12

申请号：US14869935

申请日：2015-09-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Soo Park ,  Kyoung Jin Jun ,  Young Ghyu Ahn ,  Heung Kil Park

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/228 ,  H01G4/40 ,  H05K3/30 ,  H05K3/34 ,  H01G4/12 ,  H05K3/32

Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.

公开(公告)号：US10714265B2

公开(公告)日：2020-07-14

申请号：US16267678

申请日：2019-02-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan Son ,  Seung Hyun Ra ,  Kyoung Jin Jun ,  Sang Soo Park ,  Young Key Kim ,  Soon Ju Lee

IPC: H01G4/38 ,  H01G4/012 ,  H01G4/30 ,  H05K1/18 ,  H05K1/11 ,  H01G2/06 ,  H01G4/232 ,  H01G4/12

Abstract: A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.

公开(公告)号：US09818541B2

公开(公告)日：2017-11-14

申请号：US14630448

申请日：2015-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Kyoung Jin Jun ,  Dae Hyung Yun ,  Soon Ju Lee

IPC: H05K1/18 ,  H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H05K3/34 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic electronic component and a board having the same are provided. The multilayer ceramic electronic component includes a multilayer ceramic capacitor including external electrodes including front portions and band portions extended from the front portions, terminal electrodes respectively surrounding the front portions and portions of lower surfaces of the band portions of the external electrodes and respectively having a ‘’ shaped groove portion formed in lower portions thereof, and conductive adhesive layers connecting the external electrodes and the terminal electrodes to each other.

公开(公告)号：US10448502B2

公开(公告)日：2019-10-15

申请号：US15179513

申请日：2016-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon Kim ,  Kyoung Jin Jun ,  Min Kyoung Cheon

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K1/14 ,  H05K3/30 ,  H05K1/03

Abstract: An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus.

公开(公告)号：US09697953B2

公开(公告)日：2017-07-04

申请号：US14667575

申请日：2015-03-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Seok Kyoon Woo ,  Kyoung Jin Jun ,  So Yeon Song ,  Soon Ju Lee

IPC: H01G2/20 ,  H01G4/06 ,  H01G4/228 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/224 ,  H01G4/012 ,  H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having “⊂” and “⊃” shapes, and disposed on the mounting surface of the MLCC in a facing manner.