Invention Grant
- Patent Title: Double sided buff module for post CMP cleaning
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Application No.: US13951913Application Date: 2013-07-26
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Publication No.: US10229842B2Publication Date: 2019-03-12
- Inventor: Clinton Sakata , Hui Chen , Jim K. Atkinson , Tomohiko Kitajima , Brian J. Brown
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.
Public/Granted literature
- US20150027491A1 DOUBLE SIDED BUFF MODULE FOR POST CMP CLEANING Public/Granted day:2015-01-29
Information query
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