Conductive paths through a dielectric are described that have a high aspect ratio for semiconductor devices. In one example, a semiconductor device package has a semiconductor substrate having circuitry formed on the substrate. A plurality of conductive connection pads are on the semiconductor substrate to connect to the circuitry. A post is on each of a subset of the connection pads, the posts being formed of a conductive material. A dielectric layer is over the semiconductor substrate including over the connection pads and the posts. Filled vias are over each connection pad that is not of the subset and over each post of the subset of the connection pads and a connector is over each filled via.