- Patent Title: III-N epitaxial device structures on free standing silicon mesas
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Application No.: US15505911Application Date: 2014-09-25
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Publication No.: US10229991B2Publication Date: 2019-03-12
- Inventor: Sansaptak Dasgupta , Han Wui Then , Sanaz K. Gardner , Marko Radosavljevic , Seung Hoon Sung , Benjamin Chu-Kung , Robert S. Chau
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- International Application: PCT/US2014/057474 WO 20140925
- International Announcement: WO2016/048328 WO 20160331
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L21/02 ; H01L29/417 ; H01L29/06

Abstract:
III-N semiconductor heterostructures on III-N epitaxial islands laterally overgrown from a mesa of a silicon substrate. An IC may include a III-N semiconductor device disposed on the III-N epitaxial island overhanging the silicon mesa and may further include a silicon-based MOSFET monolithically integrated with the III-N device. Lateral epitaxial overgrowth from silicon mesas may provide III-N semiconductor regions of good crystal quality upon which transistors or other active semiconductor devices may be fabricated. Overhanging surfaces of III-N islands may provide multiple device layers on surfaces of differing polarity. Spacing between separate III-N islands may provide mechanical compliance to an IC including III-N semiconductor devices. Undercut of the silicon mesa may be utilized for transfer of III-N epitaxial islands to alternative substrates.
Public/Granted literature
- US20180219087A1 III-N EPITAXIAL DEVICE STRUCTURES ON FREE STANDING SILICON MESAS Public/Granted day:2018-08-02
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