Invention Grant
- Patent Title: RRAM device and method for manufacturing the same
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Application No.: US14920635Application Date: 2015-10-22
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Publication No.: US10230047B2Publication Date: 2019-03-12
- Inventor: Frederick Chen
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
An RRAM device is provided, which includes a bottom electrode in an oxide layer, a plurality of dielectric protrusions on the oxide layer, wherein the bottom electrode is disposed between the two adjacent dielectric protrusions. A resistive switching layer is conformally disposed on the dielectric protrusions, the oxide layer, and the bottom electrode. A conductive oxygen reservoir layer is disposed on the resistive switching layer, and an oxygen diffusion barrier layer is disposed on the conductive oxygen reservoir layer.
Public/Granted literature
- US20170117463A1 RRAM DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-04-27
Information query
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