Invention Grant
- Patent Title: Power supply apparatus for sub-module of MMC
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Application No.: US15538144Application Date: 2015-12-29
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Publication No.: US10230293B2Publication Date: 2019-03-12
- Inventor: Yo-Han Baek
- Applicant: HYOSUNG HEAVY INDUSTRIES CORPORATION
- Applicant Address: KR Seoul
- Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
- Current Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
- Current Assignee Address: KR Seoul
- Agency: Novick, Kim & Lee, PLLC
- Agent Jae Youn Kim
- Priority: KR10-2014-0192749 20141229
- International Application: PCT/KR2015/014398 WO 20151229
- International Announcement: WO2016/108571 WO 20160707
- Main IPC: H02M1/08
- IPC: H02M1/08 ; H02M7/539 ; H02M1/00 ; H02M7/19 ; H02M7/49 ; H02M7/483

Abstract:
Provided is a power supply apparatus for sub-modules of a Modular Multilevel Converter (MMC) which stably supplies power to the sub-modules of the MMC in connection with an HVDC system. The power supply apparatus for sub-modules of an MMC can include a charging unit in which an input voltage between P and N busses of the MMC is stored, a relay unit connected in parallel with the charging unit, a resistor connected in series with the relay unit, a TVS diode connected in series with the resistor, a Zener diode connected in series with the TVS diode, a transformer for delivering the input voltage (in a primary winding) to a secondary winding thereof, and a switch for switching the flow of current supplied to the transformer.
Public/Granted literature
- US20170353098A1 POWER SUPPLY APPARATUS FOR SUB-MODULE OF MMC Public/Granted day:2017-12-07
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