Invention Grant
- Patent Title: Metallic ink
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Application No.: US12121260Application Date: 2008-05-15
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Publication No.: US10231344B2Publication Date: 2019-03-12
- Inventor: Yunjun Li , David Max Roundhill , Mohshi Yang , Igor Pavlovsky , Richard Lee Fink , Zvi Yaniv
- Applicant: Yunjun Li , David Max Roundhill , Mohshi Yang , Igor Pavlovsky , Richard Lee Fink , Zvi Yaniv
- Applicant Address: US TX Austin JP Hyogo
- Assignee: APPLIED NANOTECH HOLDINGS, INC.,ISHIHARA CHEMICAL CO., LTD.
- Current Assignee: APPLIED NANOTECH HOLDINGS, INC.,ISHIHARA CHEMICAL CO., LTD.
- Current Assignee Address: US TX Austin JP Hyogo
- Agency: Matheson Keys & Kordzik PLLC
- Agent Kelly Kordzik
- Main IPC: B05D3/06
- IPC: B05D3/06 ; H05K3/02 ; C23C18/14 ; B22F1/00 ; B22F1/02 ; C22C47/04 ; H01B1/02 ; H05K1/03

Abstract:
Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.
Public/Granted literature
- US20080286488A1 METALLIC INK Public/Granted day:2008-11-20
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