Invention Grant
- Patent Title: Fired multilayer stacks for use in integrated circuits and solar cells
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Application No.: US15360944Application Date: 2016-11-23
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Publication No.: US10233338B2Publication Date: 2019-03-19
- Inventor: Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
- Applicant: PLANT PV, Inc.
- Applicant Address: US CA Alameda
- Assignee: PLANT PV, Inc.
- Current Assignee: PLANT PV, Inc.
- Current Assignee Address: US CA Alameda
- Agent R'Sue Popowich Caron
- Main IPC: H01L31/02
- IPC: H01L31/02 ; C09D5/24 ; H01L31/0224 ; C03C8/18 ; C03C8/16 ; H02S40/34 ; B23K1/00 ; B23K35/02 ; B23K35/28 ; B23K35/30 ; B23K35/36 ; B33Y10/00 ; B05D1/02 ; H01L31/18 ; H01L31/049 ; H01L31/0203

Abstract:
Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
Public/Granted literature
- US20170148933A1 FIRED MULTILAYER STACKS FOR USE IN INTEGRATED CIRCUITS AND SOLAR CELLS Public/Granted day:2017-05-25
Information query
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