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公开(公告)号：US20170145224A1
公开(公告)日：2017-05-25
申请号：US15360955
申请日：2016-11-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
IPC: C09D5/24 , C03C8/18 , C03C8/16 , H01L31/0224
Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
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2.发明申请CORE-SHELL NICKEL ALLOY COMPOSITE PARTICLE METALLIZATION LAYERS FOR SILICON SOLAR CELLS 有权硅壳镍合金复合颗粒金属层用于硅太阳能电池公开(公告)号：US20150083213A1
公开(公告)日：2015-03-26
申请号：US14493346
申请日：2014-09-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Stephen T. Connor , James Randy Groves , Craig H. Peters
IPC: H01L31/0224 , H01L31/028 , H01L31/02
CPC classification number: H01L31/022425 , H01B1/02 , H01B1/16 , H01B1/20 , H01L31/0512 , Y02E10/50
Abstract: Materials and Methods for fabrication of rear tabbing, front busbar, and fine grid line layers for silicon based photovoltaic cells are disclosed. Materials include conductive metallization pastes that contain core-shell nickel based particles.
Abstract translation: 公开了用于制造后贴片，前母线和用于硅基光伏电池的细格线层的材料和方法。 材料包括含有核 - 壳镍基颗粒的导电金属化浆料。
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公开(公告)号：US10233338B2
公开(公告)日：2019-03-19
申请号：US15360944
申请日：2016-11-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
IPC: H01L31/02 , C09D5/24 , H01L31/0224 , C03C8/18 , C03C8/16 , H02S40/34 , B23K1/00 , B23K35/02 , B23K35/28 , B23K35/30 , B23K35/36 , B33Y10/00 , B05D1/02 , H01L31/18 , H01L31/049 , H01L31/0203
Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
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公开(公告)号：US20170148933A1
公开(公告)日：2017-05-25
申请号：US15360944
申请日：2016-11-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
CPC classification number: C09D5/24 , B05D1/02 , B23K1/0016 , B23K35/025 , B23K35/286 , B23K35/3006 , B23K35/3612 , B33Y10/00 , C03C8/16 , C03C8/18 , C03C2205/00 , C09D1/00 , H01L31/0201 , H01L31/0203 , H01L31/022425 , H01L31/022433 , H01L31/022441 , H01L31/049 , H01L31/1804 , H02S40/34 , Y02E10/50
Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
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公开(公告)号：US20150243812A1
公开(公告)日：2015-08-27
申请号：US14706971
申请日：2015-05-08
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Stephen T. Connor , James Randy Groves , Craig H. Peters , Jose Marcial Portilla
IPC: H01L31/0224 , C09D5/24
CPC classification number: C09D5/24 , H01B1/22 , H01L31/022425 , H01L31/068 , Y02E10/547
Abstract: Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver nanoparticles, silver microparticles, and nondeformable inorganic material particles. Specific formulations have been developed that yield printed lines with low porosities and high peel strengths.
Abstract translation: 公开了用于半导体器件的金属化糊料。 糊状物含有银纳米颗粒，银微粒和不可变形的无机材料颗粒。 已经开发了具有低孔隙率和高剥离强度的印刷线的具体配方。
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Patent Agency Ranking
公开(公告)号：US10000645B2
公开(公告)日：2018-06-19
申请号：US15360959
申请日：2016-11-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
IPC: H01L21/00 , C09D5/24 , H01L31/0224 , C03C8/18 , C03C8/16 , H02S40/34 , B23K1/00 , B23K35/02 , B23K35/28 , B23K35/30 , B23K35/36 , H01L31/02 , B33Y10/00 , B05D1/02 , H01L31/18 , H01L31/049 , H01L31/0203
CPC classification number: C09D5/24 , B05D1/02 , B23K1/0016 , B23K35/025 , B23K35/286 , B23K35/3006 , B23K35/3612 , B33Y10/00 , C03C8/16 , C03C8/18 , C03C2205/00 , C09D1/00 , H01L31/0201 , H01L31/0203 , H01L31/022425 , H01L31/022433 , H01L31/022441 , H01L31/049 , H01L31/1804 , H02S40/34 , Y02E10/50
Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.
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公开(公告)号：US09741878B2
公开(公告)日：2017-08-22
申请号：US15360952
申请日：2016-11-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
IPC: H01L31/044 , H01L31/0224 , H01L31/02 , H01L31/0203 , H01L31/049
CPC classification number: C09D5/24 , B05D1/02 , B23K1/0016 , B23K35/025 , B23K35/286 , B23K35/3006 , B23K35/3612 , B33Y10/00 , C03C8/16 , C03C8/18 , C03C2205/00 , C09D1/00 , H01L31/0201 , H01L31/0203 , H01L31/022425 , H01L31/022433 , H01L31/022441 , H01L31/049 , H01L31/1804 , H02S40/34 , Y02E10/50
Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
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8.发明申请公开(公告)号：US20130192656A1
公开(公告)日：2013-08-01
申请号：US13750756
申请日：2013-01-25
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Stephen T. Connor , James R. Groves , Craig H. Peters
IPC: H01L31/0725 , H01L31/042
CPC classification number: H01L31/078 , H01L31/02363 , H01L31/028 , H01L31/0296 , H01L31/0368 , H01L31/042 , H01L31/0445 , H01L31/048 , H01L31/0488 , H01L31/054 , H01L31/0687 , H01L31/0725 , H01L31/1836 , H02S30/10 , Y02E10/52 , Y02E10/544 , Y02P70/521
Abstract: Multi-crystalline group II-VI solar cells and methods for fabrication of same are disclosed herein. A multi-crystalline group II-VI solar cell includes a first photovoltaic sub-cell comprising silicon, a tunnel junction, and a multi-crystalline second photovoltaic sub-cell. A plurality of the multi-crystalline group II-VI solar cells can be interconnected to form low cost, high throughput flat panel, low light concentration, and/or medium light concentration photovoltaic modules or devices.
Abstract translation: 多晶组II-VI太阳能电池及其制造方法在此公开。 多晶组II-VI太阳能电池包括包含硅，隧道结和多晶第二光伏子电池的第一光伏子电池。 多个多晶II-VI族太阳能电池可以互连以形成低成本，高通量的平板，低光浓度和/或中等光浓度的光伏模块或装置。
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公开(公告)号：US20170148944A1
公开(公告)日：2017-05-25
申请号：US15360959
申请日：2016-11-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
IPC: H01L31/18 , B05D1/02 , H01L31/0224 , B33Y10/00
CPC classification number: C09D5/24 , B05D1/02 , B23K1/0016 , B23K35/025 , B23K35/286 , B23K35/3006 , B23K35/3612 , B33Y10/00 , C03C8/16 , C03C8/18 , C03C2205/00 , C09D1/00 , H01L31/0201 , H01L31/0203 , H01L31/022425 , H01L31/022433 , H01L31/022441 , H01L31/049 , H01L31/1804 , H02S40/34 , Y02E10/50
Abstract: A method of forming a fired multilayer stack are described. The method involves the steps of a) applying a wet metal particle layer on at least a portion of a surface of a substrate, b) drying the wet metal particle layer to form a dried metal particle layer, c) applying a wet intercalation layer directly on at least a portion of the dried metal particle layer to form a multilayer stack, d) drying the multilayer stack, and e) co-firing the multilayer stack to form the fired multilayer stack. The intercalating layer may include one or more of low temperature base metal particles, crystalline metal oxide particles, and glass frit particles. The wet metal particle layer may include aluminum, copper, iron, nickel, molybdenum, tungsten, tantalum, titanium, steel or combinations thereof.
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公开(公告)号：US20170148937A1
公开(公告)日：2017-05-25
申请号：US15360952
申请日：2016-11-23
Applicant: PLANT PV, Inc.
Inventor： Brian E. Hardin , Erik Sauar , Dhea Suseno , Jesse J. Hinricher , Jennifer Huang , Tom Yu-Tang Lin , Stephen T. Connor , Daniel J. Hellebusch , Craig H. Peters
IPC: H01L31/0224 , H01L31/0203 , H01L31/049 , H01L31/02
CPC classification number: C09D5/24 , B05D1/02 , B23K1/0016 , B23K35/025 , B23K35/286 , B23K35/3006 , B23K35/3612 , B33Y10/00 , C03C8/16 , C03C8/18 , C03C2205/00 , C09D1/00 , H01L31/0201 , H01L31/0203 , H01L31/022425 , H01L31/022433 , H01L31/022441 , H01L31/049 , H01L31/1804 , H02S40/34 , Y02E10/50
Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.
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