Various thermal management devices for providing thermal management of integrated circuit chips are disclosed. In one aspect, a thermal management device is provided that has a heat spreader plate that includes mechanical connection structures to enable the heat spreader plate to mount on a first circuit board and thermally contact the integrated circuit chip when the integrated circuit chip is directly mounted on the first circuit board and to enable the heat spreader plate to mount on a second circuit board having a socket and thermally contact the integrated circuit chip when the integrated circuit chip is mounted in the socket.