Invention Grant
- Patent Title: Method for 2D/3D inspection of an object such as a wafer
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Application No.: US15197408Application Date: 2016-06-29
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Publication No.: US10240977B2Publication Date: 2019-03-26
- Inventor: Gilles Fresquet , Alain Courteville , Philippe Gastaldo
- Applicant: FOGALE NANOTECH
- Applicant Address: FR Montbonnot-Saint-Martin
- Assignee: UNITY SEMICONDUCTOR
- Current Assignee: UNITY SEMICONDUCTOR
- Current Assignee Address: FR Montbonnot-Saint-Martin
- Agency: Greer, Burns & Crain, Ltd.
- Priority: EP16305348 20160325
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01J3/02 ; G01B11/22 ; G01N21/95 ; G02B21/00 ; G01N21/956 ; H01L21/66 ; G01B11/02 ; G01B11/06 ; G01N21/88 ; G01J3/18 ; G01J3/453 ; G01B11/245

Abstract:
A method is provided for inspecting the surface of an object such as a wafer having tridimensional structures, using a confocal chromatic device with a plurality of optical measurement channels and a chromatic lens allowing optical wavelengths of a broadband light source to be focused at different axial distances defining a chromatic measurement range. The method includes a step of obtaining an intensity information corresponding to the intensity of the light actually focused on an interface of the object within the chromatic measurement range at a plurality of measurement points on the object by measuring a total intensity over the full spectrum of the light collected by at least some of the optical measurement channels in a confocal configuration.
Public/Granted literature
- US20170276615A1 METHOD FOR 2D/3D INSPECTION OF AN OBJECT SUCH AS A WAFER Public/Granted day:2017-09-28
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