An electronic device includes a housing, a heat dissipation assembly and a blocking member. The housing has a dissipation portion. The heat dissipation portion includes a plurality of heat dissipation holes. The heat dissipation assembly is disposed in the housing. The heat dissipation assembly includes a plurality of heat dissipation fins. A channel is formed between every two adjacent heat dissipation fins. The channel has an air intake and an air outlet. The position of the air outlet is corresponded to the position of the heat dissipation portion. A surface is formed between the air intake and the air outlet. The blocking member is disposed at the surface position adjacent to the air outlet and abutted against the periphery of the heat dissipation portion.