Invention Grant
- Patent Title: Silver powder, method for producing same, and conductive paste
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Application No.: US15500152Application Date: 2015-07-27
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Publication No.: US10252331B2Publication Date: 2019-04-09
- Inventor: Taro Nakanoya , Hiroshi Kamiga
- Applicant: DOWA Electronics Materials Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: DOWA Electronics Materials Co., Ltd.
- Current Assignee: DOWA Electronics Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Priority: JP2014-156460 20140731; JP2015-146622 20150724
- International Application: PCT/JP2015/071293 WO 20150727
- International Announcement: WO2016/017600 WO 20160204
- Main IPC: H01B1/22
- IPC: H01B1/22 ; B22F1/00 ; B22F9/24 ; C09C3/08 ; C09C3/06 ; C09C3/10 ; C09C1/62 ; H01B5/00

Abstract:
A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.
Public/Granted literature
- US20170259333A1 Silver Powder, Method for Producing Same, and Conductive Paste Public/Granted day:2017-09-14
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