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公开(公告)号：US20190080815A1
公开(公告)日：2019-03-14
申请号：US15762766
申请日：2017-03-15
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Hiroshi Kamiga , Taro Nakanoya , Noriaki Nogami , Kenichi Harigae
IPC: H01B1/22 , C03C17/06 , C03C3/12 , H01L31/0224
CPC classification number: H01B1/22 , C03C3/122 , C03C3/321 , C03C8/02 , C03C8/16 , C03C8/18 , C03C17/06 , C03C17/10 , C03C2217/256 , C03C2217/268 , C03C2217/27 , H01L31/022425 , H01L31/1804 , Y02E10/50 , Y02P70/521
Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
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公开(公告)号：US20170259333A1
公开(公告)日：2017-09-14
申请号：US15500152
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
CPC classification number: B22F1/0062 , B22F1/0014 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2304/10 , B22F2998/10 , C01P2004/51 , C01P2006/12 , C09C1/62 , C09C3/06 , C09C3/08 , C09C3/10 , H01B1/22 , H01B5/002 , B22F3/10
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.
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公开(公告)号：US20170259334A1
公开(公告)日：2017-09-14
申请号：US15500192
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
CPC classification number: B22F1/0062 , B22F1/0014 , B22F1/0074 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B22F2998/10 , C09C1/62 , C09C3/08 , C09C3/10 , C09D5/24 , C09D7/61 , H01B1/22
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 μm or more but 6.0 μm or less, and a ratio of [(D90−D10)/D5o] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
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Patent Agency Ranking
公开(公告)号：US10252331B2
公开(公告)日：2019-04-09
申请号：US15500152
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.
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公开(公告)号：US09993871B2
公开(公告)日：2018-06-12
申请号：US15500192
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
CPC classification number: B22F1/0062 , B22F1/0014 , B22F1/0074 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B22F2998/10 , C09C1/62 , C09C3/08 , C09C3/10 , C09D5/24 , C09D7/61 , H01B1/22
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 μm or more but 6.0 μm or less, and a ratio of [(D90−D10)/D50] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
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公开(公告)号：US11376659B2
公开(公告)日：2022-07-05
申请号：US16772822
申请日：2018-12-13
Applicant: Dowa Electronics Materials Co., Ltd.
Inventor： Masaya Osako , Taro Nakanoya
Abstract: There is provided a spherical silver powder which is capable of being sintered at a lower temperature. The spherical silver powder of spherical silver particles has cavities, each of which is formed in a corresponding one of the spherical silver particles and each of which has a major axis of 100 to 1000 nm and a minor axis of 10 nm or more, the ratio of the major axis to the minor axis (major axis/minor axis) being 5 or more, the major axis being the length of the long side of a rectangle which has a minimum area and which circumscribes the outline of a cross-section of a corresponding one of the cavities on an image of the cross-section of the corresponding one of the silver particles exposed by polishing the surface of a resin after the silver powder is embedded in the resin, and the minor axis being the length of the narrow side of the rectangle.
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公开(公告)号：US20210162495A1
公开(公告)日：2021-06-03
申请号：US16772822
申请日：2018-12-13
Applicant: Dowa Electronics Materials Co., Ltd.
Inventor： Masaya Osako , Taro Nakanoya
IPC: B22F1/00
Abstract: There is provided a spherical silver powder which is capable of being sintered at a lower temperature. The spherical silver powder of spherical silver particles has cavities, each of which is formed in a corresponding one of the spherical silver particles and each of which has a major axis of 100 to 1000 nm and a minor axis of 10 nm or more, the ratio of the major axis to the minor axis (major axis/minor axis) being 5 or more, the major axis being the length of the long side of a rectangle which has a minimum area and which circumscribes the outline of a cross-section of a corresponding one of the cavities on an image of the cross-section of the corresponding one of the silver particles exposed by polishing the surface of a resin after the silver powder is embedded in the resin, and the minor axis being the length of the narrow side of the rectangle.
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公开(公告)号：US10460851B2
公开(公告)日：2019-10-29
申请号：US15762766
申请日：2017-03-15
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Hiroshi Kamiga , Taro Nakanoya , Noriaki Nogami , Kenichi Harigae
IPC: H01B1/22 , C03C17/06 , C03C3/12 , H01L31/0224 , C03C3/32 , C03C8/02 , C03C8/16 , C03C8/18 , C03C17/10 , H01L31/18
Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
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