Invention Grant
- Patent Title: Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
-
Application No.: US14879526Application Date: 2015-10-09
-
Publication No.: US10252397B2Publication Date: 2019-04-09
- Inventor: David Masayuki Ishikawa , Jeonghoon Oh , Garrett Ho Yee Sin , Charles C. Garretson , Huanbo Zhang , Chia-Ling Pai , Niraj Prasad , Julio David Muzquiz
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: B24B37/32
- IPC: B24B37/32
Abstract:
A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
Public/Granted literature
Information query
