Invention Grant
- Patent Title: Chemical mechanical polishing automated recipe generation
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Application No.: US15621638Application Date: 2017-06-13
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Publication No.: US10256111B2Publication Date: 2019-04-09
- Inventor: Eric Lau , King Yi Heung , Charles C. Garretson , Jun Qian , Thomas H. Osterheld , Shuchivrat Datar , David Chui
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/32
- IPC: H01L21/32 ; H01L21/321 ; G01B11/03 ; G01B11/06 ; H01L21/304 ; H01L21/3105 ; H01L21/66
Abstract:
A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.
Public/Granted literature
- US20180005842A1 CHEMICAL MECHANICAL POLISHING AUTOMATED RECIPE GENERATION Public/Granted day:2018-01-04
Information query
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