Invention Grant
- Patent Title: Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
-
Application No.: US14523827Application Date: 2014-10-24
-
Publication No.: US10256120B2Publication Date: 2019-04-09
- Inventor: Clinton P. Sakata , Hui Chen , Jim K. Atkinson , Brian J. Brown , Jianshe Tang , Yufei Chen , Yunshuang Ding
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/67 ; B08B1/00 ; B08B1/04
Abstract:
In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.
Public/Granted literature
- US20150114430A1 SYSTEMS, METHODS AND APPARATUS FOR POST-CHEMICAL MECHANICAL PLANARIZATION SUBSTRATE BUFF PRE-CLEANING Public/Granted day:2015-04-30
Information query
IPC分类:
