Invention Grant
- Patent Title: Manufacturing method of a molded photosensitive assembly of an array imaging module
-
Application No.: US15679146Application Date: 2017-08-16
-
Publication No.: US10274694B2Publication Date: 2019-04-30
- Inventor: Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Ningbo, Zhejiang
- Assignee: Ningbo Sunny Opotech Co., Ltd.
- Current Assignee: Ningbo Sunny Opotech Co., Ltd.
- Current Assignee Address: CN Ningbo, Zhejiang
- Agency: David and Raymond Patent Firm
- Agent Raymond Y. Chan
- Priority: CN201610143457 20160312; CN201620191631U 20160312; CN201610149444 20160315; CN201620201261 20160315; CN201610214411 20160407; CN201610669214 20160812; CN201620875781U 20160812; CN201620876056U 20160812; WOPCT/CN2016/103736 20161028
- Main IPC: H05K3/34
- IPC: H05K3/34 ; G02B7/02 ; G02B3/00 ; G02B5/20 ; G02B7/00 ; H04M1/02 ; H04N5/225 ; H05K1/02 ; H05K1/18 ; B29C45/14 ; H01L27/146 ; H01L21/56 ; H01L25/065 ; G02B13/00 ; B29L31/34
Abstract:
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
Public/Granted literature
Information query
