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公开(公告)号：US11570336B2
公开(公告)日：2023-01-31
申请号：US17242211
申请日：2021-04-27
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Feifan Chen , Liang Ding , Nan Guo , Ye Wu , Heng Jiang
IPC: H04N5/225 , H01L27/146
Abstract: A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
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公开(公告)号：US10735637B2
公开(公告)日：2020-08-04
申请号：US16436934
申请日：2019-06-11
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC: H04N5/225 , H04N13/239 , H01L27/146
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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3.发明授权公开(公告)号：US10678016B2
公开(公告)日：2020-06-09
申请号：US16427369
申请日：2019-05-31
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Heng Jiang , Feifan Chen , Chunmei Liu , Bojie Zhao , Nan Guo , Liang Ding
Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
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4.发明授权公开(公告)号：US10353167B2
公开(公告)日：2019-07-16
申请号：US15784166
申请日：2017-10-15
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Heng Jiang , Feifan Chen , Chunmei Liu , Bojie Zhao , Nan Guo , Liang Ding
Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
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公开(公告)号：US10281674B2
公开(公告)日：2019-05-07
申请号：US15057044
申请日：2016-02-29
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Liang Ding , Chunmei Liu , Feifan Chen , Nan Guo , Heng Jiang
Abstract: An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.
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Patent Agency Ranking
公开(公告)号：US10277792B2
公开(公告)日：2019-04-30
申请号：US15460235
申请日：2017-03-16
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC: H04N5/225 , H04N13/239 , H01L27/146
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US10192914B2
公开(公告)日：2019-01-29
申请号：US15494413
申请日：2017-04-21
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang , Nan Guo , Zhenyu Chen , Zhewen Mei
IPC: H01L27/146 , H04N5/225 , H04N13/239
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US10126519B2
公开(公告)日：2018-11-13
申请号：US15705232
申请日：2017-09-14
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
IPC: G02B13/16 , H04N5/225 , G02B7/02 , G02B3/00 , G02B5/20 , G02B7/00 , H04M1/02 , H05K1/02 , H05K1/18 , B29C45/14 , H01L27/146 , H01L21/56 , H01L25/065 , B29L31/34
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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9.发明申请公开(公告)号：US20180164529A1
公开(公告)日：2018-06-14
申请号：US15317117
申请日：2016-10-28
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
CPC classification number: G02B7/021 , B29C45/14639 , B29L2031/3481 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B13/001 , G02B13/004 , H01L21/565 , H01L25/0655 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/14687 , H01L27/1469 , H01L2224/48091 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121 , H01L2924/00014
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US09906700B2
公开(公告)日：2018-02-27
申请号：US15473609
申请日：2017-03-30
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
IPC: H04N5/225 , G02B3/00 , H05K1/18 , G02B7/00 , H05K1/02 , G02B5/20 , G02B7/02 , H04M1/02 , H01L27/146
CPC classification number: H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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