Invention Grant
- Patent Title: Semiconductor structure including high electron mobility transistor device
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Application No.: US15886724Application Date: 2018-02-01
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Publication No.: US10283614B1Publication Date: 2019-05-07
- Inventor: Ming-Chang Lu , Wei Chen
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/10 ; H01L29/20 ; H01L29/267 ; H01L21/02 ; H01L29/43 ; H01L29/778 ; H01L29/417

Abstract:
Provided is a semiconductor structure including a substrate, a first semiconductor layer, a second semiconductor layer, a gate electrode, a source electrode and a drain electrode. The first semiconductor layer contains a group III-V-VI semiconductor compound layer and is disposed on the substrate. The second semiconductor layer includes a group III-V semiconductor compound and is disposed on the first semiconductor layer. The gate electrode is disposed on the second semiconductor layer. The source electrode and the drain electrode are disposed on the second semiconductor layer beside the gate electrode.
Information query
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