Invention Grant
- Patent Title: Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node
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Application No.: US16202145Application Date: 2018-11-28
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Publication No.: US10285261B1Publication Date: 2019-05-07
- Inventor: Tomi Simula , Vinski Bräysy , Mikko Heikkinen , Juha-Matti Hintikka , Juhani Harvela , Minna Pirkonen , Pasi Raappana , Tuomas Heikkilä , Jarmo Sääski
- Applicant: TactoTek Oy
- Applicant Address: FI Oulunsalo
- Assignee: TACTOTEK OY
- Current Assignee: TACTOTEK OY
- Current Assignee Address: FI Oulunsalo
- Agency: Carter, DeLuca & Farrell LLP
- Agent Robert P. Michal, Esq.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/40 ; H05K3/00 ; H05K3/46 ; H05K3/32 ; H05K1/11 ; H05K1/14 ; H05K1/18
Abstract:
An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.
Information query
