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公开(公告)号：US12096562B2
公开(公告)日：2024-09-17
申请号：US18644647
申请日：2024-04-24
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Ilpo Hänninen , Antti Keränen , Tomi Simula , Vinski Bräysy , Pälvi Apilo , Pasi Korhonen , Topi Wuori
CPC classification number: H05K1/185 , B29C51/14 , G01P1/02 , H05K3/0014 , H05K3/306 , B29L2031/3425 , H05K2201/10151 , H05K2201/10265 , H05K2203/1327 , H05K2203/166
Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.
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公开(公告)号：US11914184B2
公开(公告)日：2024-02-27
申请号：US18339467
申请日：2023-06-22
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: G02B6/0031 , G02B6/004 , G02B6/0021 , G02B6/0036 , G02B6/0041 , G02B6/0043 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US11594482B2
公开(公告)日：2023-02-28
申请号：US17368244
申请日：2021-07-06
Applicant: TactoTek Oy
Inventor： Jarmo Sääski , Mikko Heikkinen , Tero Heikkinen , Mika Paani , Jan Tillonen , Ronald Haag
IPC: H05K5/00 , H01L23/522 , H05K3/46 , H01L23/50 , H01L23/14 , H01L25/065 , H05K3/28 , H05K1/18 , H05K3/40
Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.
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公开(公告)号：US11166364B2
公开(公告)日：2021-11-02
申请号：US16833744
申请日：2020-03-30
Applicant: TACTOTEK OY
Inventor： Antti Keränen , Tomi Simula , Mikko Heikkinen , Jarmo Sääski , Pasi Raappana , Minna Pirkonen
Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
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公开(公告)号：US11166363B2
公开(公告)日：2021-11-02
申请号：US16245643
申请日：2019-01-11
Applicant: TACTOTEK OY
Inventor： Antti Keränen , Tomi Simula , Mikko Heikkinen , Jarmo Sääski , Pasi Raappana , Minna Pirkonen
Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
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Patent Agency Ranking
公开(公告)号：US20210243898A1
公开(公告)日：2021-08-05
申请号：US17215001
申请日：2021-03-29
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.
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公开(公告)号：US10986735B2
公开(公告)日：2021-04-20
申请号：US16168927
申请日：2018-10-24
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.
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公开(公告)号：US10986734B2
公开(公告)日：2021-04-20
申请号：US16140633
申请日：2018-09-25
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.
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公开(公告)号：US20190389106A1
公开(公告)日：2019-12-26
申请号：US16561213
申请日：2019-09-05
Applicant: TactoTek Oy
Inventor： Anne Isohätälä , Hasse Sinivaara , Mikko Heikkinen
Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
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公开(公告)号：US20190069409A1
公开(公告)日：2019-02-28
申请号：US16038864
申请日：2018-07-18
Applicant: TactoTek Oy
Inventor： Antti Keranen , Ronald Haag , Mikko Heikkinen
Abstract: A method for manufacturing a multilayer structure, includes obtaining a first substrate film for accommodating electronics, said first substrate film having a first side and an opposite second side, said first substrate film including electrically substantially insulating material, said first substrate film preferably being formable and/or thermoplastic, providing, optionally by mounting and/or by printed electronics technology, circuitry on at least said second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film, and molding, optionally by injection molding or reactive molding, plastic material on the first side of the first substrate film so as to at least partially cover it.
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