Invention Grant
- Patent Title: Element chip manufacturing method
-
Application No.: US15822568Application Date: 2017-11-27
-
Publication No.: US10297487B2Publication Date: 2019-05-21
- Inventor: Shogo Okita , Atsushi Harikai , Noriyuki Matsubara , Akihiro Itou
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2016-236922 20161206
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/311 ; H01L21/78 ; H01L21/304 ; H01L23/00 ; H01J37/00 ; H01L21/67
Abstract:
Provided is a method of manufacturing a semiconductor chip, the method comprising: preparing a plurality of semiconductor chips, each of which has a surface to which a BG tape is stuck, and a rear surface to which a DAF is stuck, and which are held spaced from each other by the BG tape and the DAF, exposing the DAF between semiconductor chips that are adjacent to each other when viewed from the surface side, by stripping the BG tape from the surface of each of the plurality of semiconductor chips, etching the DAF that is exposed between the semiconductor chips that are adjacent to each other, by irradiating the plurality of semiconductor chips held on the DAF, with plasma.
Public/Granted literature
- US20180158713A1 ELEMENT CHIP MANUFACTURING METHOD Public/Granted day:2018-06-07
Information query
IPC分类:
