Invention Grant
- Patent Title: Base plate for heat sink as well as heat sink and IGBT module having the same
-
Application No.: US15769589Application Date: 2016-10-28
-
Publication No.: US10297525B2Publication Date: 2019-05-21
- Inventor: Qing Gong , Yaxuan Sun , Xinping Lin , Shuming Zhao , Bo Wu , Jingjing Luo , Donghai Cheng
- Applicant: BYD COMPANY LIMITED
- Applicant Address: CN
- Assignee: BYD COMPANY LIMITED
- Current Assignee: BYD COMPANY LIMITED
- Current Assignee Address: CN
- Agency: Calfee, Halter & Griswold LLP
- Priority: CN201520862189U 20151030
- International Application: PCT/CN2016/103806 WO 20161028
- International Announcement: WO2017/071652 WO 20170504
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L23/367 ; H01L23/473 ; H05K7/20 ; H01L25/07 ; H01L29/739

Abstract:
A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N
Public/Granted literature
- US20180317342A1 BASE PLATE FOR HEAT SINK AS WELL AS HEAT SINK AND IGBT MODULE HAVING THE SAME Public/Granted day:2018-11-01
Information query
IPC分类: