Invention Grant
- Patent Title: Flexible circuit board having enhanced bending durability
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Application No.: US15923017Application Date: 2018-03-16
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Publication No.: US10299375B2Publication Date: 2019-05-21
- Inventor: Sang Pil Kim , Da Yeon Lee , Hwang Sub Koo , Hyun Je Kim , Hee Seok Jung
- Applicant: GigaLane Co., Ltd.
- Applicant Address: KR Hwaseong-si, Gyeonggi-Do
- Assignee: GigaLane Co., Ltd.
- Current Assignee: GigaLane Co., Ltd.
- Current Assignee Address: KR Hwaseong-si, Gyeonggi-Do
- Agency: Brundidge & Stanger, P.C.
- Priority: KR10-2015-0135385 20150924
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/11 ; H05K3/46 ; H05K3/00 ; H05K3/28
Abstract:
The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
Public/Granted literature
- US20180206331A1 FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY Public/Granted day:2018-07-19
Information query
