公开(公告)号：US20180206331A1

公开(公告)日：2018-07-19

申请号：US15923017

申请日：2018-03-16

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/028 ,  H05K1/0225 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/4691 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2203/0228 ,  H05K2203/107

Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.

公开(公告)号：US10561015B2

公开(公告)日：2020-02-11

申请号：US16375947

申请日：2019-04-05

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

公开(公告)号：US10477690B2

公开(公告)日：2019-11-12

申请号：US16075198

申请日：2017-02-08

Applicant: GIGALANE CO., LTD.

Inventor： Ik Soo Kim ,  Byung Yeol Kim ,  Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/18 ,  H01P3/08 ,  H05K1/02

Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.

公开(公告)号：US10365687B2

公开(公告)日：2019-07-30

申请号：US16077067

申请日：2016-07-05

Applicant: GIGALANE CO., LTD.

Inventor： Ik Soo Kim ,  Byung Yeol Kim ,  Sang Pil Kim ,  Byung Hoon Jo ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: G06F1/16 ,  H05K5/00 ,  H05K5/02

Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.

公开(公告)号：US11489241B2

公开(公告)日：2022-11-01

申请号：US16972644

申请日：2019-07-18

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Byung Hoon Jo ,  Da Yeon Lee ,  Byung Yeol Kim ,  Hee seok Jung

IPC: H01P3/08

Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.

公开(公告)号：US10750612B2

公开(公告)日：2020-08-18

申请号：US16375944

申请日：2019-04-05

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

公开(公告)号：US10448499B2

公开(公告)日：2019-10-15

申请号：US16224965

申请日：2018-12-19

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Byung Hoon Jo ,  Da Yeon Lee ,  Byung Yeol Kim ,  Hee seok Jung

IPC: H05K1/02 ,  H05K1/18

Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.

公开(公告)号：US20190230785A1

公开(公告)日：2019-07-25

申请号：US16224965

申请日：2018-12-19

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Byung Hoon Jo ,  Da Yeon Lee ,  Byung Yeol Kim ,  Hee seok Jung

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0222 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09327

Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.

公开(公告)号：US10356895B2

公开(公告)日：2019-07-16

申请号：US15923070

申请日：2018-03-16

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil Kim ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

公开(公告)号：US20180206335A1

公开(公告)日：2018-07-19

申请号：US15923070

申请日：2018-03-16

Applicant: GigaLane Co., Ltd.

Inventor： Sang Pil KIM ,  Da Yeon Lee ,  Hwang Sub Koo ,  Hyun Je Kim ,  Hee Seok Jung

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/40 ,  H05K3/00 ,  H05K3/06 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0281 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/0038 ,  H05K3/0044 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/093 ,  H05K2201/09845 ,  H05K2203/0228 ,  H05K2203/107

Abstract: Provided are a flexible circuit board having enhanced bending durability and a method for preparing same. A method for preparing a flexible circuit board having enhanced bending durability, according to the present invention, comprises the steps of: (a) forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on the bottom side of the first dielectric body; (b) preparing a second dielectric body; (c) preparing a first bonding sheet and a first protective sheet which is connected to one end of the first boding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; (d) bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; (e) forming a via hole such that the first ground layer and second ground layer can be conducted; and (f) cutting in the width direction the second dielectric body placed on the first protective sheet.