Invention Grant
- Patent Title: Bone void forming apparatus
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Application No.: US14992726Application Date: 2016-01-11
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Publication No.: US10299929B2Publication Date: 2019-05-28
- Inventor: Carlos E. Collazo
- Applicant: Howmedica Osteonics Corp.
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: A61B17/17
- IPC: A61B17/17 ; A61B17/16 ; A61F2/30 ; A61F2/38 ; A61F2/36 ; A61F2/40 ; A61B90/00 ; A61F2/28

Abstract:
A bone void forming assembly includes a support member having a head portion and an elongate portion extending therefrom. A guide member is connected to the support member and has a guide body including a channel extending therethrough. The channel defines an axis offset and obliquely angled relative to an axis of the elongate portion. The assembly also includes reamer having a cutting head and a stop member. A bushing is slidably connected to the reamer between the stop member and cutting head and is slidably connectable to the guide body via the channel.
Public/Granted literature
- US20160199071A1 BONE VOID FORMING APPARATUS Public/Granted day:2016-07-14
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