Invention Grant
- Patent Title: Low-profile mechanical retention
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Application No.: US15782526Application Date: 2017-10-12
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Publication No.: US10300545B2Publication Date: 2019-05-28
- Inventor: Teodor Dabov , John Bernard Ardisana, II , Ashutosh Y. Shukla
- Applicant: Snap Inc.
- Applicant Address: US CA Santa Monica
- Assignee: Snap Inc.
- Current Assignee: Snap Inc.
- Current Assignee Address: US CA Santa Monica
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01H3/12
- IPC: H01H3/12 ; B23K1/00 ; B23K1/19 ; H01R12/50 ; H01R13/426 ; B23K33/00 ; B23K101/36

Abstract:
An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint. The assembly may be in the form of a movable push button for control of an electronic device.
Public/Granted literature
- US20190111508A1 LOW-PROFILE MECHANICAL RETENTION Public/Granted day:2019-04-18
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