Invention Grant
- Patent Title: Plasma generating apparatus using mutual inductive coupling and substrate treating apparatus comprising the same
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Application No.: US14516766Application Date: 2014-10-17
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Publication No.: US10312060B2Publication Date: 2019-06-04
- Inventor: Hee Sun Chae , Jeong Hee Cho , Jong Sik Lee , Han Saem Rhee , Hyun Jun Kim
- Applicant: PSK INC.
- Applicant Address: KR Gyeonggi-do
- Assignee: PSK INC.
- Current Assignee: PSK INC.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0143316 20131122
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
Provided are a plasma generating apparatus using mutual inductive coupling and a substrate treating apparatus including the same. According to an embodiment of the present invention, a plasma generating apparatus includes: an RF power supply providing an RF signal; a plurality of electromagnetic field applying units inducing an electromagnetic field by receiving the RF signal; and a reactance element connected to a ground terminal of the electromagnetic field applying unit, wherein each of the electromagnetic field applying units may include a plurality of mutually-inductively coupled coils.
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