A dual connector system includes a host circuit board and first and second electrical connectors mounted to the host circuit board. The first electrical connector has a housing having a card slot for a module circuit board and the second electrical connector has a housing having an upper mating surface for the module circuit board. The housing has a first side and an opposite second side with connector latching features and holding second contacts at the upper mating surface between the first and second sides. A dual connector module is mated to the first and second electrical connectors. A securing strap is secured to the dual connector module and has a first strap latching feature being latchably coupled to the corresponding connector latching feature to secure the dual connector module to the second electrical connector.