Invention Grant
- Patent Title: Metal recycling method and metal recycling equipment thereof
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Application No.: US15276141Application Date: 2016-09-26
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Publication No.: US10319618B2Publication Date: 2019-06-11
- Inventor: Chun-Lung Tseng , Hung-Yao Lin , Hsin-Yi Wang , Chin-Kang Hu , Sheng-Hsiung Chuang
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Ditthavong & Steiner, P.C.
- Priority: TW104131722A 20150925
- Main IPC: B44C1/14
- IPC: B44C1/14 ; H05K3/02 ; H05K3/04 ; B32B37/00 ; B32B38/10 ; H01L21/67
Abstract:
A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.
Public/Granted literature
- US20170092528A1 METAL RECYCLING METHOD AND METAL RECYCLING EQUIPMENT THEREOF Public/Granted day:2017-03-30
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