An interconnection component includes a first support portion, a second support portion, a redistribution layer and a passive device, wherein at least one of the first and second support portions is comprised of a semiconductor material. The first support portion includes first and second opposed major surfaces and a plurality of first conductive vias extending through the first support portion substantially perpendicular to major surfaces. The second support portion includes first and second opposed major surfaces and a plurality of second conductive vias extending through the second support portion substantially perpendicular to the first and second major surfaces of the second support. The redistribution layer can be disposed between the second surfaces of the first and second support portions. The passive device can be positioned at least partially within the redistribution layer and electrically connected with one or more of the first conductive vias and the second conductive vias.