The present disclosure provides systems and methods for a package securing system including a top plate, an alignment frame, a gasket, and a back plate. The top plate comprises a thermal conductive member to transfer heat from a central processing unit (CPU) and secure the CPU to a ball grid array (BGA) socket and a printed circuit board (PCB). The alignment frame is configured to align a connection between the BGA socket and the PCB. The gasket is to seal the CPU, the BGA socket, and the alignment frame between the PCB and the top plate. The back plate is configured to couple with the top plate through the PCB.