In one embodiment, a blanking aperture array is for a multi-charged particle beam writing apparatus. The blanking aperture array includes a substrate and a plurality of blankers. Each of the plurality of blankers includes a blanking electrode and a ground electrode that are formed on a first surface of the substrate. The plurality of blankers includes at least a normal blanker which is capable of applying a predetermined voltage between the blanking electrode and the ground electrode and for which a through hole bored through the substrate is formed, and a defective blanker which is not capable of applying the predetermined voltage between the blanking electrode and the ground electrode and for which the through hole bored through the substrate is filled with a beam shield.