Invention Grant
- Patent Title: Semiconductor memory device and data setting method
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Application No.: US15888865Application Date: 2018-02-05
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Publication No.: US10347348B2Publication Date: 2019-07-09
- Inventor: Hidemitsu Kojima
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP2017-019711 20170206
- Main IPC: G11C16/32
- IPC: G11C16/32 ; G11C16/10 ; G11C16/04 ; G11C7/22 ; G11C16/08

Abstract:
The invention provides a semiconductor memory device capable of setting input data correctly, including: an input circuit outputting input data to a data bus; a logic circuit outputting the input data on the data bus to digit lines selected by a column address in response to a writing clock signal synchronized with an external clock signal; a page buffer holding data of the digit lines in holding circuits of a column selected by the column address in response to an inner clock signal generated by delaying the writing clock signal, and an address counter generating the column address in response to the writing clock signal. The column address is supplied to the logic circuit in response to the writing clock signal, and the column address is supplied to the page buffer in response to the inner clock signal which has been delayed.
Public/Granted literature
- US20180226130A1 SEMICONDUCTOR MEMORY DEVICE AND DATA SETTING METHOD Public/Granted day:2018-08-09
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