Apparatus and methods of forming an apparatus can include one or more cell contacts in an integrated circuit in a variety of applications. In various embodiments, a resist underlayer can be formed on a dielectric spacer formed on a structure for a cell contact, where the structure can include a patterned area of pillars on a silicon-rich dielectric anti-reflective coating region disposed on a dielectric region. The resist underlayer, the dielectric spacer, the patterned area of pillars, the silicon-rich dielectric anti-reflective coating, and the dielectric region can be processed to form an array of columns in the dielectric region. Regions between the columns of the array of columns can be filled with conductive material, forming the cell contact. Additional apparatus, systems, and methods are disclosed.