Invention Grant
- Patent Title: Metallic contact for optoelectronic semiconductor device
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Application No.: US15784905Application Date: 2017-10-16
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Publication No.: US10347793B2Publication Date: 2019-07-09
- Inventor: Alexander Lunev , Maxim S. Shatalov , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
- Applicant: Sensor Electronic Technology, Inc.
- Applicant Address: US SC Columbia
- Assignee: Sensor Electronic Technology, Inc.
- Current Assignee: Sensor Electronic Technology, Inc.
- Current Assignee Address: US SC Columbia
- Agency: LaBatt, LLC
- Main IPC: H01L33/40
- IPC: H01L33/40 ; H01L33/38 ; H01L33/00 ; H01L29/225 ; H01L29/205 ; H01L31/0336 ; H01L29/267 ; H01L31/00 ; H01L33/14 ; H01L31/0224 ; H01L33/24 ; H01L33/08

Abstract:
A contact to a semiconductor layer in a light emitting structure is provided. The contact can include a plurality of contact areas formed of a metal and separated by a set of voids. The contact areas can be separated from one another by a characteristic distance selected based on a set of attributes of a semiconductor contact structure of the contact and a characteristic contact length scale of the contact. The voids can be configured to increase an overall reflectivity or transparency of the contact.
Public/Granted literature
- US20180053879A1 Metallic Contact for Optoelectronic Semiconductor Device Public/Granted day:2018-02-22
Information query
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