Invention Grant
- Patent Title: Pad patterns
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Application No.: US15570879Application Date: 2015-06-29
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Publication No.: US10349517B2Publication Date: 2019-07-09
- Inventor: Charles Nathan Logan , Adrian Rothenbuhler , Christine M. Wells
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2015/038270 WO 20150629
- International Announcement: WO2017/003422 WO 20170105
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/40 ; H05K1/02 ; H05K1/09

Abstract:
In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry.
Public/Granted literature
- US20180295719A1 PAD PATTERNS Public/Granted day:2018-10-11
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