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公开(公告)号:US20180295719A1
公开(公告)日:2018-10-11
申请号:US15570879
申请日:2015-06-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Charles Nathan Logan , Adrian Rothenbuhler , Christine m. Wells
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/09 , H05K1/111 , H05K1/112 , H05K3/4007 , H05K3/4038 , H05K2201/09227 , H05K2201/094 , H05K2201/09409 , H05K2201/09781
Abstract: In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry.
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公开(公告)号:US10884073B2
公开(公告)日:2021-01-05
申请号:US16329877
申请日:2016-09-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Dee Chou , Adrian Rothenbuhler , Eric Young , Tiffany L Greyson
Abstract: An example device includes a physical interface to connect to a system. The device also includes a power source to deliver power to a diagnostic portion of the system via the physical interface. The diagnostic portion draws a small amount of power. The power source delivers the power based on the system not receiving power from an internal source. The device also includes a reporting engine to communicatively couple to the system via the physical interface. The reporting engine retrieves an indication of whether a cable in the system is connected.
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公开(公告)号:US10349517B2
公开(公告)日:2019-07-09
申请号:US15570879
申请日:2015-06-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Charles Nathan Logan , Adrian Rothenbuhler , Christine M. Wells
Abstract: In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry.
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公开(公告)号:US20190195934A1
公开(公告)日:2019-06-27
申请号:US16329877
申请日:2016-09-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Dee Chou , Adrian Rothenbuhler , Eric Young , Tiffany L Greyson
IPC: G01R31/04
CPC classification number: G01R31/041 , B41J2/04548
Abstract: An example device includes a physical interface to connect to a system. The device also includes a power source to deliver power to a diagnostic portion of the system via the physical interface. The diagnostic portion draws a small amount of power. The power source delivers the power based on the system not receiving power from an internal source. The device also includes a reporting engine to communicatively couple to the system via the physical interface. The reporting engine retrieves an indication of whether a cable in the system is connected.
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