Invention Grant
- Patent Title: Semiconductor device including a transistor with a gate dielectric having a variable thickness
-
Application No.: US15062370Application Date: 2016-03-07
-
Publication No.: US10355087B2Publication Date: 2019-07-16
- Inventor: Martin Vielemeyer , Andreas Meiser , Till Schloesser , Franz Hirler , Martin Poelzl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/78 ; H01L29/66 ; H01L21/28 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L21/265

Abstract:
A semiconductor device includes a transistor in a semiconductor substrate having a main surface. The transistor includes a source region, a drain region, a channel region, a drift zone, a gate electrode, and a gate dielectric adjacent to the gate electrode. The gate electrode is disposed adjacent to at least two sides of the channel region. The channel region and the drift zone are disposed along a first direction parallel to the main surface between the source region and the drain region. The gate dielectric has a thickness that varies at different positions of the gate electrode.
Public/Granted literature
- US20160190256A1 Semiconductor Device Including a Transistor with a Gate Dielectric Having a Variable Thickness Public/Granted day:2016-06-30
Information query
IPC分类: