Invention Grant
- Patent Title: Planar light emitting device
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Application No.: US15578153Application Date: 2016-07-20
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Publication No.: US10361386B2Publication Date: 2019-07-23
- Inventor: Hidemaro Saiki
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Alleman Hall Creasman & Tuttle LLP
- Priority: JP2015-167199 20150826
- International Application: PCT/JP2016/071318 WO 20160720
- International Announcement: WO2017/033630 WO 20170302
- Main IPC: H01L51/50
- IPC: H01L51/50 ; F21V23/00 ; F21K9/278 ; F21K9/238 ; F21S2/00 ; H05B33/06 ; H01L51/52 ; H05K1/02 ; H05K1/18 ; H05K1/14

Abstract:
Provided is a planar light emitting device which is highly productive employing inexpensive FPCs capable of being easily electrically connected, and which has a light emitting region with reduced unevenness in luminance and hence is highly reliable. The planar light emitting device, which has a light emitting surface and a back surface, includes a planar light emitting tile including a planar light emitting element and a plurality of flexible printed circuits (FPCs) disposed on the back surface. The planar light emitting tile includes a non-pad region where none of an anode pad and a cathode pad are disposed. In an overlapped region where part of two circuit boards overlap each other, an electrical connection site where an equipotential region of the two circuit boards are directly electrically connected to each other is formed. The non-pad region forms a connecting-part disposed region that overlaps with the electrical connection site.
Public/Granted literature
- US20180151820A1 PLANAR LIGHT EMITTING DEVICE Public/Granted day:2018-05-31
Information query
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