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公开(公告)号:US10288263B2
公开(公告)日:2019-05-14
申请号:US15500215
申请日:2015-07-27
Applicant: KANEKA CORPORATION
Inventor: Akira Nishikawa , Yukinobu Hamada , Hidemaro Saiki , Tsukasa Sumiyoshi
IPC: F21V15/01 , F21V21/14 , F21V23/06 , H01L51/52 , F21Y105/00 , F21Y105/10 , F21Y115/20
Abstract: The present invention has an object to provide a planar light-emitting panel attached with a jacket to protect edges of a light-emitting tile, while the jacket is prevented from being peeled off or removed from the light-emitting tile. The planar light-emitting panel includes the light-emitting using a glass substrate as a base, and an elastic jacket covering end faces of the glass substrate. An emission surface is provided on a front face of the light-emitting tile. The elastic jacket has a rear face side opening, on a rear face side of the light-emitting tile. On opening edges of the rear face side opening, when viewed from rear, a plurality of jacket side protrusions protruding toward a center side of the rear face side opening are formed. The jacket side protrusions are separated at predetermined intervals along the opening edges.
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公开(公告)号:US10361386B2
公开(公告)日:2019-07-23
申请号:US15578153
申请日:2016-07-20
Applicant: KANEKA CORPORATION
Inventor: Hidemaro Saiki
IPC: H01L51/50 , F21V23/00 , F21K9/278 , F21K9/238 , F21S2/00 , H05B33/06 , H01L51/52 , H05K1/02 , H05K1/18 , H05K1/14
Abstract: Provided is a planar light emitting device which is highly productive employing inexpensive FPCs capable of being easily electrically connected, and which has a light emitting region with reduced unevenness in luminance and hence is highly reliable. The planar light emitting device, which has a light emitting surface and a back surface, includes a planar light emitting tile including a planar light emitting element and a plurality of flexible printed circuits (FPCs) disposed on the back surface. The planar light emitting tile includes a non-pad region where none of an anode pad and a cathode pad are disposed. In an overlapped region where part of two circuit boards overlap each other, an electrical connection site where an equipotential region of the two circuit boards are directly electrically connected to each other is formed. The non-pad region forms a connecting-part disposed region that overlaps with the electrical connection site.
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公开(公告)号:US20170338283A1
公开(公告)日:2017-11-23
申请号:US15525510
申请日:2016-01-29
Applicant: KANEKA CORPORATION
Inventor: Hidemaro Saiki , Akira Nishikawa
IPC: H01L27/32 , F21S2/00 , H01L51/52 , F21Y105/00 , F21Y2115/20
CPC classification number: H01L27/32 , F21S2/005 , F21S8/03 , F21V15/01 , F21V19/004 , F21V23/001 , F21V23/005 , F21V29/508 , F21V29/83 , F21Y2105/00 , F21Y2115/15 , F21Y2115/20 , H01L51/5221 , H01L51/5237 , H01L51/524 , H01L51/529 , H01L2251/5361
Abstract: To provide, in a simple and cost-effective manner, a planar light-emitting module with reduced thickness as a whole, with its substrate end ensuring shock resistance and low risk of injury, and being excellent in transferring and dissipating heat. A light-emitting module of the present invention includes: a bezel having a leg part having an inner height H; a planar light-emitting tile; and a printed circuit board having a plurality of heat dissipating through holes. A heat dissipating interval is provided between the printed circuit board and the mounted surface. The printed circuit board includes a tile-side main surface being a soaking metal layer including through hole openings.
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公开(公告)号:US20170276317A1
公开(公告)日:2017-09-28
申请号:US15500215
申请日:2015-07-27
Applicant: KANEKA CORPORATION
Inventor: Akira Nishikawa , Yukinobu Hamada , Hidemaro Saiki , Tsukasa Sumiyoshi
CPC classification number: F21V3/061 , F21V15/01 , F21V21/14 , F21V23/06 , F21Y2105/00 , F21Y2105/10 , F21Y2115/20 , H01L51/524 , H01L51/5253 , H01L51/5268
Abstract: The present invention has an object to provide a planar light-emitting panel attached with a jacket to protect edges of a light-emitting tile, while the jacket is prevented from being peeled off or removed from the light-emitting tile. The planar light-emitting panel includes the light-emitting using a glass substrate as a base, and an elastic jacket covering end faces of the glass substrate. An emission surface is provided on a front face of the light-emitting tile. The elastic jacket has a rear face side opening, on a rear face side of the light-emitting tile. On opening edges of the rear face side opening, when viewed from rear, a plurality of jacket side protrusions protruding toward a center side of the rear face side opening are formed. The jacket side protrusions are separated at predetermined intervals along the opening edges.
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公开(公告)号:US10304905B2
公开(公告)日:2019-05-28
申请号:US15525510
申请日:2016-01-29
Applicant: KANEKA CORPORATION
Inventor: Hidemaro Saiki , Akira Nishikawa
IPC: H01L51/52 , F21V29/83 , H01L27/32 , F21V19/00 , F21V23/00 , F21S2/00 , F21S8/00 , F21V15/01 , F21Y105/00 , F21V29/508 , F21Y115/15 , F21Y115/20
Abstract: To provide, in a simple and cost-effective manner, a planar light-emitting module with reduced thickness as a whole, with its substrate end ensuring shock resistance and low risk of injury, and being excellent in transferring and dissipating heat. A light-emitting module of the present invention includes: a bezel having a leg part having an inner height H; a planar light-emitting tile; and a printed circuit board having a plurality of heat dissipating through holes. A heat dissipating interval is provided between the printed circuit board and the mounted surface. The printed circuit board includes a tile-side main surface being a soaking metal layer including through hole openings.
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公开(公告)号:US20180151820A1
公开(公告)日:2018-05-31
申请号:US15578153
申请日:2016-07-20
Applicant: KANEKA CORPORATION
Inventor: Hidemaro Saiki
CPC classification number: H01L51/5012 , F21K9/238 , F21K9/278 , F21S2/00 , F21V23/00 , H01L51/5008 , H01L51/5203 , H05B33/06 , H05K1/0263 , H05K1/141 , H05K1/189 , H05K2201/049 , H05K2201/10106 , H05K2201/10272
Abstract: Provided is a planar light emitting device which is highly productive employing inexpensive FPCs capable of being easily electrically connected, and which has a light emitting region with reduced unevenness in luminance and hence is highly reliable. The planar light emitting device, which has a light emitting surface and a back surface, includes a planar light emitting tile including a planar light emitting element and a plurality of flexible printed circuits (FPCs) disposed on the back surface. The planar light emitting tile includes a non-pad region where none of an anode pad and a cathode pad are disposed. In an overlapped region where part of two circuit boards overlap each other, an electrical connection site where an equipotential region of the two circuit boards are directly electrically connected to each other is formed. The non-pad region forms a connecting-part disposed region that overlaps with the electrical connection site.
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