Invention Grant
- Patent Title: Flexible circuit board having three-layer dielectric body and four-layer ground layer structure
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Application No.: US15923048Application Date: 2018-03-16
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Publication No.: US10362675B2Publication Date: 2019-07-23
- Inventor: Sang Pil Kim , Da Yeon Lee , Hwang Sub Koo , Hyun Je Kim , Hee Seok Jung
- Applicant: GigaLane Co., Ltd.
- Applicant Address: KR Hwaseong-si
- Assignee: GIGALANE CO., LTD.
- Current Assignee: GIGALANE CO., LTD.
- Current Assignee Address: KR Hwaseong-si
- Agency: Brundidge & Stanger, P.C.
- Priority: KR10-2015-0135435 20150924
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K3/00 ; H05K1/03 ; H05K3/46

Abstract:
Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
Public/Granted literature
- US20180206332A1 FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-LAYER GROUND LAYER STRUCTURE Public/Granted day:2018-07-19
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