A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.