公开(公告)号：US09578756B2

公开(公告)日：2017-02-21

申请号：US14564122

申请日：2014-12-09

Applicant: IBIDEN Co., Ltd.

Inventor： Hiroyuki Nishioka ,  Shinsuke Ishikawa

IPC: H05K1/09 ,  C08F2/46 ,  C08J7/18 ,  H05H1/00 ,  H05H1/24 ,  H05K3/46 ,  H01L23/538 ,  H01L21/48 ,  H01L23/498

CPC classification number: H05K3/4644 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/15311 ,  H05K2203/095

Abstract: A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. Each of the resin insulation layers includes a modified resin layer formed by plasma treatment such that the modified resin layer is forming the surface of each of the resin insulation layers, each of the conducive layers includes a modified conductive layer formed by the plasma treatment such that the modified conductive layer is forming the surface of each of the conductive layers, and the modified resin layer has a surface modification different from a surface modification of the modified conductive layer.

Abstract translation: 印刷布线板包括树脂绝缘层，分别形成在树脂绝缘层上的导电层，使得每个导电层形成在每个树脂绝缘层的表面上，以及通孔导体分别贯穿树脂绝缘层，使得 通孔导体通过树脂绝缘层连接导电层。 每个树脂绝缘层包括通过等离子体处理形成的改性树脂层，使得改性树脂层形成每个树脂绝缘层的表面，每个导电层包括通过等离子体处理形成的改性导电层，使得 改性导电层正在形成每个导电层的表面，并且改性树脂层具有与改性导电层的表面改性不同的表面改性。

公开(公告)号：US20170303396A1

公开(公告)日：2017-10-19

申请号：US15487560

申请日：2017-04-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyuki Nishioka ,  Shinsuke Ishikawa

IPC: H05K1/11 ,  H05K3/28 ,  H05K3/00 ,  H05K1/03 ,  G03F7/40 ,  G03F7/038 ,  G03F7/031 ,  G03F7/16 ,  G03F7/09 ,  G03F7/039 ,  G03F7/20 ,  G03F7/32

CPC classification number: H05K1/113 ,  G03F7/028 ,  G03F7/031 ,  G03F7/038 ,  G03F7/039 ,  G03F7/094 ,  G03F7/095 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/32 ,  G03F7/40 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/112 ,  H05K3/0055 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0195 ,  H05K2201/0269 ,  H05K2203/0776

Abstract: A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.

公开(公告)号：US09591771B2

公开(公告)日：2017-03-07

申请号：US14564126

申请日：2014-12-09

Applicant: IBIDEN Co., Ltd.

Inventor： Hiroyuki Nishioka ,  Shinsuke Ishikawa

IPC: H05K1/09 ,  C08F2/46 ,  C08J7/18 ,  H05H1/00 ,  H05H1/24 ,  H05K3/46 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K3/4644 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/12042 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2203/095 ,  H01L2924/00

Abstract: A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate compound layer.

Abstract translation: 印刷布线板包括树脂绝缘层，分别形成在树脂绝缘层上的导电层，使得每个导电层形成在每个树脂绝缘层的表面上，以及通孔导体分别贯穿树脂绝缘层，使得 通孔导体通过树脂绝缘层连接导电层。 导电层和通孔导体形成为使得导电层和每个通路导体中的每一个包括无电镀铜膜，具有Cu 3 N + Cu（NH）x的中间化合物层并形成在无电镀铜 膜和在中间化合物层上形成的电解铜电镀膜。

公开(公告)号：US10368438B2

公开(公告)日：2019-07-30

申请号：US15487560

申请日：2017-04-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyuki Nishioka ,  Shinsuke Ishikawa

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/34 ,  G03F7/031 ,  G03F7/038 ,  G03F7/039 ,  G03F7/09 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H05K3/00 ,  H05K3/28 ,  G03F7/028 ,  G03F7/095

Abstract: A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.

公开(公告)号：US20150034365A1

公开(公告)日：2015-02-05

申请号：US14447687

申请日：2014-07-31

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyuki NISHIOKA ,  Shinsuke Ishikawa

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/113 ,  H05K3/244 ,  H05K3/3452 ,  H05K2203/0594 ,  H05K2203/095

Abstract: A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer is covering the conductive pattern and exposing a conductive pad portion of the conductive pattern, applying microwave plasma on the wiring board in a nonoxidative atmosphere such that the wiring board undergoes microwave plasma treatment in the nonoxidative atmosphere, and forming a surface-treatment layer on the conductive pad portion of the conductive pattern after the applying of microwave plasma on the wiring board.

Abstract translation: 一种布线基板的制造方法，其特征在于，准备具有绝缘层，导电图案和阻焊层的布线基板，所述布线基板层叠所述阻焊层覆盖所述导体图案并露出所述导电图案的导电焊盘部， 在非氧化性气氛中在布线基板上施加微波等离子体，使得布线板在非氧化性气氛中进行微波等离子体处理，在布线上施加微波等离子体之后，在导体图案的导电焊盘部分上形成表面处理层 板。